测试半导体产品测试仪美国McBain
1.. McBain DDR200 NIR and DDR300 NIR
Near Infrared Subsurface Defect Detection and Review Systems
The McBain DDR200 NIR (for 200mm) and DDR300 NIR (for 300mm) provide high-speed defect detection and precision measurement on wafers and other parts. These cost-efficient systems offer unique advantages for both production and process development use, providing an optimum near-infrared (900-1700nm) solution when both subsurface defect detection and dimensional metrology are required.
These DDR systems feature a powerful set of automated and semi-automated optical and digital video tools, which are optimized for high accuracy, production throughput and ease of use. The automated and versatile platform features McBain's state-of-the-art near-infrared Koehler Epi-illumination as well as optional transmitted-illumination packages. All systems are configured on McBain Systems' precision multi-axis platforms.
Applications
· For in-process, post-process and failure analysis
· Bonded wafer alignment
· Die alignment (flip-chip or hybridization)
· Subsurface defect visualization, detection, characterization
· MEMS device inspection and metrology
· 3D stacking process development and control
Key Features
Designed for automatic / semiautomatic operation
· Extensive defect detection features and capability
· Integrated dimensional metrology features
· Able to penetrate thicker materials, more highly doped materials and rougher surfaces than other systems
· Submicron-precision optical measurements
· High-accuracy staging, to 20nm linear encoder resolution
· Highest resolution 900-1700nm InGaAs digital camera in class
· High-speed linear servo motor staging
· 50-500 defects/measurement/second per field of view, typical
· Very easy to use, program and set up
· Multiple wafer/die/part handling systems available
· Application-specific customizable software
· Semi Standard S2/S8 compliant
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2 . McBain DDR200 and DDR300
200mm and 300mm Defect Detection and Review Systems
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